By A. Fletcher
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Additional info for Advanced Organics for Electronic Substrates and Packages
The figures for growth given above may well affect the market for plastic packages as European telecommunications companies have moved to these lower cost technologies. In addition, levels of investment may be affected by increasing competition between the telecommunications companies. Growth in Europe will be affected by levels of investment in a unified Germany and by the status of the national telecommunication companies investment programmes. Shortage of hard 35 Advanced Organics currency will mean that Eastern Europe will not be a major factor for some years to come.
The regional breakdown in these figure shows estimates of an increase in the US market of between 12% and 15% to a 1992 value of US$35 000 million. 5% to a 1992 figure of US$12 000 million. 5% to a 1992 figure of US$36 000 million, with growth rates varying between 5% and 6% for France and Italy to 8% for the UK and 12% for Germany. The figures for growth given above may well affect the market for plastic packages as European telecommunications companies have moved to these lower cost technologies.
When designing components these factors must be taken into account. Moulded plastic packages are one of the lowest cost packages available and a CERDIP will typically cost five times as much as a PDIP. Moulded plastic packages belong to the non-hermetic group of products and are vulnerable to moisture penetration and related failures. Ceramics and metal packages are hermetic and are used for high reliability applications. The IC is fabricated by a series of lithographic processes and each individual step constitutes a level in the device with the final level being the metallisation pattern to interconnect the circuit elements that have been fabricated on the surface of the silicon wafer.